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89400-0320 Molex 89400-0320 is a 2.00mm pitch vertical through-hole wire-to-board header with 3 circuits. It features partial shrouding, a locking mechanism, and is rated for 4A and 250V.
Mfr Part #:

89400-0320

Available from 2 distributors
Mfr Name: Molex
Molex
Molex 89400-0320 is a 2.00mm pitch vertical through-hole wire-to-board header with 3 circuits. It features partial shrouding, a locking mechanism, and is rated for 4A and 250V.
Total Stock: 208 pcs

89400-0320 Available from 2 distributors

Authorised
Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
205 pcs
205 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
3 pcs
3 pcs On Request 1 On Request On Request On Request On Request On Request

89400-0320 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Agency Certifications
Contact Plating - Mating
Contact Plating - Termination
Current Rating
Durability
Duration at Max Process Temperature
Flammability Rating
Glow Wire
Glow-Wire Compliant
Insulation Material
Lead Style
Lead-free Process Capability
Lock to Mating Part
Low Halogen
Low-Halogen Status
Mated Height
Max Cycles at Max Process Temperature
Number of Positions
Number of Rows
Operating Temperature Range
Orientation
PC Tail Length
PCB Retention
Packaging Type
Pitch
Plating Thickness Mating
Plating Thickness Termination
Process Temperature (Max)
REACH SVHC
Recommended PCB Thickness
Shrouded
Termination Style
Voltage Rating

89400-0320 Description

Short technical summary and product information.

The Molex 89400-0320 is a 2.00mm pitch wire-to-board header designed for signal and power applications. It has 3 circuits arranged in a single row, with a vertical through-hole termination style. The header is partially shrouded and includes a lock to mating part for secure connections.

 

Key electrical specifications include a maximum current rating of 4A per contact and a voltage rating of 250V. The operating temperature range is -25°C to +85°C, making it suitable for a wide range of environments. The header is rated for 30 mating cycles and has a mated height of 7.30mm.

 

The housing is made of nylon with a 94V-0 flammability rating, and the contacts are tin-plated on both mating and termination ends. The PCB retention feature ensures reliable soldering, with a recommended PCB thickness of 1.20mm. The component is packaged in a bag and is RoHS compliant, REACH unaffected, and low-halogen.

89400-0320 Quick Information

Product Type: Headers, Male Pins
Series: 89400
Canonical Name: 2.00mm Pitch Wire-to-Board Header, Vertical, 3 Circuits, Partial Shroud, Through Hole, Tin Plating
Subcategory: Wire-to-Board Header

89400-0320 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: Compliant (No SVHC)

89400-0320 Features

  • 2.00mm pitch for compact wire-to-board designs.
  • Vertical through-hole mounting for easy PCB assembly.
  • Rated for 4A max current per contact.
  • Partial shrouded for guided mating.
  • Lock to mating part ensures secure connection.

89400-0320 Applications

  • Used in signal wire-to-board connections.
  • Suitable for compact electronic devices.
  • Ideal for automotive and industrial control units.
  • Common in consumer electronics wiring.

89400-0320 FAQs

7 frequently asked questions generated from this part’s specifications.
What is the pitch of the Molex 89400-0320 header?

The pitch is 2.00 mm.

How many positions does the 89400-0320 have?

It has 3 positions (circuits).

What is the current rating of this header?

The maximum current rating per contact is 4 A.

What is the voltage rating?

The maximum voltage rating is 250 V.

What is the mounting style of the 89400-0320?

It is a vertical through-hole mounting header.

What is the operating temperature range?

The operating temperature range is -25°C to +85°C.

Is the header shrouded?

Yes, it is partially shrouded.

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