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824-AG31D-ESL-LF TE Connectivity 824-AG31D-ESL-LF is a 24-position (2x12) DIP IC socket with 2.54mm pitch, through hole mounting, and gold flash contacts. Open frame design with beryllium copper contacts.
Mfr Part #:

824-AG31D-ESL-LF

Available from 1 distributors
Mfr Name: TE Connectivity
TE Connectivity
TE Connectivity 824-AG31D-ESL-LF is a 24-position (2x12) DIP IC socket with 2.54mm pitch, through hole mounting, and gold flash contacts. Open frame design with beryllium copper contacts.
Total Stock: 50 pcs

824-AG31D-ESL-LF Available from 1 distributors

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824-AG31D-ESL-LF Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Contact Finish
Contact Finish Thickness
Contact Material
Features
Housing Material
Lead Style
Mounting Type
Number of Positions or Pins (Grid)
Operating Temperature
Pitch
Tape & Reel
Termination
Termination Style
Type

824-AG31D-ESL-LF Description

Short technical summary and product information.

TE Connectivity 824-AG31D-ESL-LF is a 24-position (2x12) DIP IC socket designed for through-hole mounting. It features a 2.54mm (0.100 inch) pitch and gold flash contact finish on beryllium copper contacts for reliable electrical connections. The open frame design allows for air flow and easy inspection of solder joints. The housing is made of polycyclohexylenedimethylene terephthalate (PCT) and polyester, providing good mechanical strength and thermal stability. The socket operates over a temperature range of -55°C to 105°C, making it suitable for a variety of industrial and commercial applications.

824-AG31D-ESL-LF Quick Information

Product Type: IC Socket
Series: 824
Canonical Name: TE Connectivity 824-AG31D-ESL-LF DIP IC Socket, 24 Position (2x12), 2.54mm Pitch, Through Hole, Open Frame
Subcategory: DIP Sockets

824-AG31D-ESL-LF Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

824-AG31D-ESL-LF Features

  • 24-position DIP socket with 2.54mm pitch.
  • Gold flash contacts on beryllium copper.
  • Open frame design for airflow and inspection.
  • Operating temperature range -55°C to 105°C.
  • Through hole mounting with solder termination.

824-AG31D-ESL-LF Applications

  • Used for prototyping IC circuits on breadboards.
  • Ideal for production DIP package ICs.
  • Suitable for industrial control systems.
  • Common in testing and development boards.

824-AG31D-ESL-LF FAQs

7 frequently asked questions generated from this part’s specifications.
How many positions does this socket have?

24 positions (2x12).

What is the pitch of this DIP socket?

2.54mm (0.100 inches).

What is the mounting type?

Through hole.

What is the contact finish?

Gold flash.

What is the operating temperature range?

-55°C to 105°C.

What is the housing material?

Polycyclohexylenedimethylene Terephthalate (PCT) and Polyester.

What is the contact material?

Beryllium Copper.

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