| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,320 pcs
|
1320 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Contact Finish | |
| Contact Finish Thickness | |
| Contact Material | |
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| Halogen Free | |
| Housing Material | |
| Lead Spacing | |
| Lead Style | |
| Mounting Type | |
| Number of Positions or Pins (Grid) | |
| Operating Temperature | |
| Pitch | |
| Storage Temperature | |
| Tape & Reel | |
| Termination | |
| Termination Style | |
| Type |
The TE Connectivity 824-AG12D is a 24-position DIP IC socket designed for through-hole mounting. It features a 0.6" (15.24mm) row spacing and a 2.54mm (0.100") pitch, making it suitable for standard DIP packages.
The socket uses an open frame construction with a polyester housing and copper alloy contacts finished with 80.0µin (2.03µm) of tin-lead. It operates over a temperature range of -55°C to 105°C.
This socket is intended for applications requiring reliable, solderable connections for 24-pin DIP ICs. The open frame design allows for airflow and inspection of solder joints.
24 positions (2 x 12 grid).
2.54mm (0.100").
Through hole.
Tin-lead with 80.0µin (2.03µm) thickness.
-55°C to 105°C.