| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
113 pcs
|
113 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Contact Finish | |
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| Contact Material | |
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| Housing Material | |
| Lead Spacing | |
| Mounting Type | |
| Number of Positions | |
| Number of Positions or Pins (Grid) | |
| Number of Rows | |
| Operating Temperature | |
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| Package Type | |
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| Termination | |
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| Type |
The TE Connectivity 824-AG11D is a 24-position (2x12) dual in-line IC socket designed for through-hole mounting. It features a standard 2.54mm (0.100") pitch and 15.24mm (0.6") row spacing, compatible with common DIP packages. The socket uses copper alloy contacts with a tin-lead finish (25.0µin / 0.63µm thickness) and a polyester housing. The open frame design facilitates airflow and visual inspection of solder joints. This part operates over a temperature range of -55°C to 105°C, making it suitable for a wide range of industrial and commercial applications.
24 positions arranged as 2 rows of 12 (2x12).
Pitch is 2.54mm (0.100") and row spacing is 15.24mm (0.6").
Through-hole with solder termination.
-55°C to 105°C.
Yes, it features an open frame design.