| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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780 pcs
|
780 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
44 pcs
|
44 pcs | On Request | 10 | On Request | On Request | On Request | On Request | On Request |
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The TE Connectivity 820-AG11D-ESL-LF is a 20-position DIP socket designed for integrated circuits with 0.3" (7.62mm) row spacing. It features a 2.54mm (0.100") pitch and through-hole solder termination, making it suitable for standard PCB assembly processes.
The socket uses an open-frame construction with a housing made of Polycyclohexylenedimethylene Terephthalate (PCT) and polyester. Contacts are beryllium copper with a gold flash finish, providing reliable electrical connections and corrosion resistance. The operating temperature range is -55°C to 105°C.
This component is RoHS3 compliant and has an MSL of 1 (unlimited). It is intended for use in prototyping, production, and testing applications where a durable, low-profile IC socket is required.
20 positions arranged in a 2x10 grid with 0.3" (7.62mm) row spacing.
2.54mm (0.100").
Through hole with solder termination.
-55°C to 105°C.
Beryllium copper contacts with gold flash finish.
RoHS3 compliant (unverified).