818-AG11D-ESL-LF The 818-AG11D-ESL-LF is a 18-position DIP IC socket by TE Connectivity with 2.54mm pitch, gold contacts, and through hole mounting. It operates from -55°C to 105°C.
Mfr Part #:

818-AG11D-ESL-LF

Available from 1 distributors
Mfr Name: TE Connectivity
TE Connectivity
The 818-AG11D-ESL-LF is a 18-position DIP IC socket by TE Connectivity with 2.54mm pitch, gold contacts, and through hole mounting. It operates from -55°C to 105°C.
Total Stock: 2,444 pcs

818-AG11D-ESL-LF Available from 1 distributor

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818-AG11D-ESL-LF Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Contact Finish
Contact Finish Thickness
Contact Material
Features
Housing Material
Lead Spacing
Mounting Type
Number of Positions
Number of Positions or Pins (Grid)
Operating Temperature
Package Type
Pitch
Tape & Reel
Termination
Termination Style
Type

818-AG11D-ESL-LF Description

Short technical summary and product information.

This IC socket from TE Connectivity is a DIP type with 18 positions arranged in a 2x9 grid, 2.54mm pitch, and 0.3 inch (7.62mm) row spacing. It features through hole mounting with solder termination, making it suitable for standard PCB assembly.

 

The contacts are made of beryllium copper with a gold flash finish for reliable electrical performance and corrosion resistance. The housing is constructed from polycyclohexylenedimethylene terephthalate (PCT) and polyester, providing good mechanical strength and thermal stability. The open frame design allows airflow and facilitates inspection of solder joints.

 

The socket operates across a wide temperature range of -55°C to 105°C, accommodating harsh environments. It is RoHS3 compliant and REACH unaffected, though these compliance claims are unverified. This component is ideal for prototyping, production, and testing applications where a reliable connection to an 18-pin DIP IC is required.

818-AG11D-ESL-LF Quick Information

Product Type: IC Socket
Canonical Name: IC Socket, DIP, 0.3" Row Spacing, 18 Positions (2x9), Through Hole, Gold Contact Finish
Subcategory: DIP Socket

818-AG11D-ESL-LF Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

818-AG11D-ESL-LF Features

  • Open frame design for airflow and inspection.
  • Gold flash contact finish for corrosion resistance.
  • Beryllium copper contacts for reliable connection.
  • Wide operating temperature range -55°C to 105°C.
  • Through hole mounting for secure attachment.

818-AG11D-ESL-LF Applications

  • Used for programming and testing DIP ICs.
  • Ideal for prototyping and production sockets.
  • Suitable for industrial control circuit boards.
  • Mounts on PCB with 0.3 inch row spacing.
  • Accepts standard 18-pin DIP packages.

818-AG11D-ESL-LF FAQs

7 frequently asked questions generated from this part’s specifications.
How many positions does this socket have?

It has 18 positions arranged in a 2x9 grid.

What is the pitch of this socket?

The pitch is 2.54mm (0.100").

What is the mounting type?

Through hole mounting with solder termination.

What is the operating temperature range?

-55°C to 105°C.

What is the contact material?

Beryllium copper with gold flash finish.

What is the row spacing?

0.3 inch (7.62mm).

Is this socket RoHS compliant?

RoHS3 compliant (unverified).

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