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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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2,444 pcs
|
2444 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Number of Positions or Pins (Grid) | |
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This IC socket from TE Connectivity is a DIP type with 18 positions arranged in a 2x9 grid, 2.54mm pitch, and 0.3 inch (7.62mm) row spacing. It features through hole mounting with solder termination, making it suitable for standard PCB assembly.
The contacts are made of beryllium copper with a gold flash finish for reliable electrical performance and corrosion resistance. The housing is constructed from polycyclohexylenedimethylene terephthalate (PCT) and polyester, providing good mechanical strength and thermal stability. The open frame design allows airflow and facilitates inspection of solder joints.
The socket operates across a wide temperature range of -55°C to 105°C, accommodating harsh environments. It is RoHS3 compliant and REACH unaffected, though these compliance claims are unverified. This component is ideal for prototyping, production, and testing applications where a reliable connection to an 18-pin DIP IC is required.
It has 18 positions arranged in a 2x9 grid.
The pitch is 2.54mm (0.100").
Through hole mounting with solder termination.
-55°C to 105°C.
Beryllium copper with gold flash finish.
0.3 inch (7.62mm).
RoHS3 compliant (unverified).