| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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40 pcs
|
40 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
24 pcs
|
24 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The TE Connectivity 808-AG11D is an 8-position DIP socket designed for through-hole mounting. It features a 0.3 inch (7.62mm) row spacing and a 2.54mm (0.100 inch) pitch, accommodating standard 8-pin DIP ICs in a 2x4 grid arrangement.
The socket employs an open frame construction with a polyester housing, allowing for improved airflow and easier inspection of solder joints. Contacts are made of copper alloy with a tin-lead finish of 25.0 microinches (0.63 micrometers), providing reliable electrical connections.
This socket is rated for an operating temperature range of -55°C to 105°C, making it suitable for a wide variety of industrial and commercial applications. Termination is via solder, and the component is RoHS3 compliant (unverified).
The 808-AG11D has 8 positions arranged in a 2x4 grid.
The pitch is 2.54mm (0.100 inches).
Through-hole mounting with solder termination.
-55°C to 105°C.
Tin-lead with a thickness of 25.0 microinches (0.63 micrometers).
Polyester.
It features an open frame design.