| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
30 pcs
|
30 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
| Contact Finish | |
| Contact Finish Thickness | |
| Contact Material | |
| Features | |
| Housing Material | |
| Lead Spacing | |
| Lead Style | |
| Mounting Type | |
| Number of Positions or Pins (Grid) | |
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| Type |
The TE Connectivity 808-AG10D is an 8-position DIP IC socket designed for through hole mounting. It features a 2.54mm (0.100") pitch and gold-plated copper alloy contacts with a thickness of 25.0µin (0.63µm). The open frame polyester housing allows for easy inspection and cleaning. This socket is suitable for a wide range of IC packaging and operates over a temperature range of -55°C to 105°C. It is RoHS3 compliant and has an MSL of 1 (unlimited).
| Qty | Low | High |
|---|---|---|
| 25+ | $3.49 | $3.49 |
| 150+ | $3.42 | $3.42 |
| 250+ | $3.35 | $3.35 |
| 450+ | $3.29 | $3.29 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
8 positions (2 x 4).
2.54mm (0.100").
Through hole.
Gold, 25.0µin (0.63µm) thickness.
-55°C to 105°C.
Yes, RoHS3 compliant (unverified).