| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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5 pcs
|
5 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The TE Connectivity 8-215570-8 is a Micro-MaTch series IDC DIP header connector designed for direct wire-to-board applications. It features 18 positions arranged in 2 rows with a row spacing of 0.100" (2.54 mm) and a cable pitch of 0.050" (1.27 mm). The connector accepts 28 AWG stranded or solid wire and terminates via IDC (Insulation Displacement Connection).
Mounting is through hole with press-fit retention, and the connector includes a feed-through feature for pass-through wiring. The contact finish is tin, and the housing is red. This connector is suitable for applications requiring a reliable, compact interface between ribbon cable and a PCB.
The board-side pitch is 0.100" (2.54 mm), matching standard DIP header layouts. The connector is RoHS3 compliant and has an MSL of 1 (unlimited).
| Qty | Low | High |
|---|---|---|
| 1+ | $2.67 | $2.67 |
| 10+ | $2.33 | $2.33 |
| 25+ | $2.23 | $2.23 |
| 100+ | $2.08 | $2.08 |
| 250+ | $1.57 | $1.57 |
| 500+ | $1.51 | $1.51 |
| 1,000+ | $1.26 | $1.26 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
Ribbon Cable, DIP Header.
18 positions.
0.100" (2.54 mm).
28 AWG, stranded or solid.
Through Hole, Press-Fit.
IDC (Insulation Displacement Connection).
Micro-MaTch.