| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,566 pcs
|
3566 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
143 pcs
|
143 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Termination Style |
The Molex 74441-0007 is an XFP (10 Gigabit Small Form Factor Pluggable) connector assembly designed for high-speed data transmission applications. It features 30 positions with a gold contact finish (15 microinches) for reliable signal integrity and corrosion resistance. The connector uses surface mount termination with solder contacts, making it suitable for automated PCB assembly processes.
This pluggable connector assembly is part of Molex's XFP product line, commonly used in networking, telecommunications, and data center equipment where compact, high-density interconnects are required. The surface mount package allows for efficient board-level integration, and the gold plating ensures durability over repeated mating cycles.
While specific electrical ratings such as current and voltage are not provided in the available data, the XFP form factor is standardized for high-speed serial links. Designers should refer to the XFP MSA specification for detailed performance parameters. The component is listed as RoHS3 compliant, though this compliance is unverified.
30 positions.
Surface mount.
XFP (10 Gigabit Small Form Factor Pluggable).
Gold, 15 microinches.
Solder.
Yes, listed as RoHS3 compliant (unverified).