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73644-1016 Molex 73644-1016 is an HDM Board-to-Board Backplane Header with 144 circuits arranged in 6 rows and 24 columns. It features a vertical orientation, press-fit termination, and gold contact plating.
Mfr Part #:

73644-1016

Available from 1 distributors
Mfr Name: Molex
Molex
Molex 73644-1016 is an HDM Board-to-Board Backplane Header with 144 circuits arranged in 6 rows and 24 columns. It features a vertical orientation, press-fit termination, and gold contact plating.
Total Stock: 216 pcs

73644-1016 Available from 1 distributor

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73644-1016 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Color
Connector Style
Connector Type
Contact Finish
Contact Finish - Mating
Contact Finish Thickness
Contact Finish Thickness (Minimum @ Mating)
Contact Finish Thickness (Minimum @ Termination)
Current Rating
Data Rate
Durability (Mating Cycles)
First Mate / Last Break
Flammability Rating
Halogen Free
Lead Spacing
Lead Style
Material - Metal
Material - Resin
Mounting Type
Net Weight
Number of Columns
Number of Pairs
Number of Positions
Number of Positions Loaded
Number of Rows
Operating Temperature Range
Orientation
PC Tail Length
PCB Locator
PCB Retention
PCB Thickness Recommended
Packaging Type
Pitch
Polarized to PCB
Real Signals per 25mm
Shielded
Stackable
Surface Mount Compatible
Termination
Termination Style
Voltage Rating

73644-1016 Description

Short technical summary and product information.

The Molex 73644-1016 is an HDM Backplane Connector System header designed for high-density board-to-board backplane applications. It offers 144 circuits in a 6-row by 24-column configuration with a 2.00mm pitch, enabling compact and reliable interconnections. The header uses a vertical orientation and press-fit termination for secure through-hole mounting, with a recommended PCB thickness of 2.50mm and a PC tail length of 3.50mm.

 

Electrically, each contact supports a maximum current of 1.0A and a voltage rating of 250V AC, with a data rate of 1 Gbps. The contacts are gold-plated (30µin minimum on mating, 2µin on termination) for reliable signal integrity. The housing is made of high-temperature thermoplastic with a flammability rating of 94V-0, and the metal contacts are phosphor bronze and stainless steel.

 

Designed for durability, the connector withstands up to 250 mating cycles and operates over a temperature range of -55°C to +105°C. It is stackable and surface mount compatible (SMC), with a guide post location B for alignment. The part is packaged in tubes and is RoHS3 compliant with low-halogen status.

73644-1016 Quick Information

Product Type: Backplane Header
Series: 73644
Canonical Name: HDM Board-to-Backplane Header, Vertical, Press-Fit, 144 Circuits, Guide Post B
Subcategory: Backplane Connector Header

73644-1016 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

73644-1016 Features

  • 144 circuits in 6 rows, 24 columns.
  • 2.00mm pitch for high-density backplane designs.
  • Vertical press-fit through-hole termination.
  • Gold plating on mating contacts (30µin).
  • Rated for 1.0A per contact and 250V AC.

73644-1016 Applications

  • Ideal for high-density backplane interconnect systems.
  • Used in telecommunications and data networking equipment.
  • Suitable for server and storage backplane applications.
  • Designed for press-fit assembly in 2.50mm PCB thickness.

73644-1016 FAQs

7 frequently asked questions generated from this part’s specifications.
How many positions does the Molex 73644-1016 have?

144 positions.

What is the pitch of this connector?

2.00mm.

What is the current rating per contact?

1.0A per contact maximum.

What is the voltage rating?

250V AC maximum.

What is the mounting type?

Through hole with press-fit termination.

What is the operating temperature range?

-55°C to +105°C.

How many mating cycles is this connector rated for?

250 cycles maximum.

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