| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,000 pcs
|
2000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Material Finish | |
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The 7141DG is a board level vertical heat sink designed for cooling TO-220 semiconductor packages. It is made of copper with a tin finish for corrosion resistance. The heat sink has rectangular fins and measures 0.515 inches in fin height, 0.780 inches in length, and 0.520 inches in width. It offers a thermal resistance of 20.30°C/W under natural convection and 10.00°C/W at 200 LFM forced air flow, with a power dissipation of 1.0W at a 30°C temperature rise. The attachment method uses a clip and PC pin for secure mounting on PCBs. This heat sink is suitable for applications requiring efficient thermal management of TO-220 devices in confined spaces.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.90 | $2.90 |
| 10+ | $2.63 | $2.63 |
| 25+ | $2.44 | $2.44 |
| 50+ | $2.37 | $2.37 |
| 100+ | $2.01 | $2.01 |
| 250+ | $1.89 | $1.89 |
| 500+ | $1.80 | $1.80 |
| 1,000+ | $1.77 | $1.77 |
| 2,500+ | $1.74 | $1.74 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The 7141DG is designed for TO-220 packages.
Yes, it is marked as RoHS3 compliant, but this is unverified.
Thermal resistance is 20.30°C/W under natural convection and 10.00°C/W at 200 LFM forced air flow.
It is made of copper with a tin finish.
It uses a clip and PC pin attachment method.