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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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7,000 pcs
|
7000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Lead Style | |
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| Material | |
| Material Finish | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| Shape | |
| Tape & Reel | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
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| Width |
The 7136DG is a board level heatsink designed for cooling TO-220 semiconductor packages. It features a rectangular fin geometry with a fin height of 13.08mm, overall width of 13.21mm, and length of 21.55mm. The heatsink is constructed from copper with a tin finish for corrosion resistance and solderability.
Thermal performance is specified at 19.70°C/W under natural convection and 6.00°C/W with forced air flow at 500 LFM. Power dissipation capability is 1.0W for a 30°C temperature rise. The attachment method uses a clip and PC pin for secure mounting to the TO-220 package.
This heatsink is suitable for a variety of power management and thermal management applications where board-level cooling of TO-220 devices is required. It can be used in both natural and forced convection environments.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.49 | $1.49 |
| 3,000+ | $1.48 | $1.48 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The 7136DG is designed for TO-220 packages.
19.70°C/W under natural convection and 6.00°C/W at 500 LFM forced air flow.
Copper with a tin finish.
Length 21.55mm, width 13.21mm, fin height 13.08mm.
RoHS3 compliant, but this status is unverified.
Clip and PC pin attachment method.
1.0W.