| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
5,500 pcs
|
5500 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
14 pcs
|
14 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Length | |
| Material | |
| Material Finish | |
| Mounting Type | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| Shape | |
| Tape & Reel | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
The 7109DG is a top mount heat sink designed for TO-263 (D²Pak) packages. It features a rectangular finned shape and is constructed from copper with a tin finish. The heat sink measures 19.38mm in length and 25.40mm in width, with a fin height of 11.43mm (0.450").
Thermal performance is rated at 11.00°C/W under natural convection and 3.00°C/W at 300 LFM forced air flow. It can dissipate 2.0W at a 30°C temperature rise. The attachment method is an SMD pad, making it suitable for surface mount applications.
This heat sink is intended for use with TO-263 (D²Pak) packages, providing a compact thermal management solution for power devices. The copper construction offers good thermal conductivity, while the tin finish provides a solderable surface for SMD mounting.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.82 | $1.82 |
| 10+ | $1.65 | $1.65 |
| 25+ | $1.61 | $1.61 |
| 50+ | $1.57 | $1.57 |
| 100+ | $1.49 | $1.49 |
| 250+ | $1.41 | $1.41 |
| 500+ | $1.32 | $1.32 |
| 1,000+ | $1.26 | $1.26 |
| 2,000+ | $1.17 | $1.17 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 11.00°C/W under natural convection and 3.00°C/W at 300 LFM forced air flow.
The heat sink can dissipate 2.0W at a 30°C temperature rise.
The 7109DG is designed to cool TO-263 (D²Pak) packages.
The mounting type is top mount with an SMD pad attachment method.
The heat sink is made of copper with a tin finish.