7109DG Top mount heat sink for TO-263 (D²Pak) packages. Copper with tin finish, 11°C/W natural convection, 3°C/W at 300 LFM.
Mfr Part #:

7109DG

Available from 2 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Top mount heat sink for TO-263 (D²Pak) packages. Copper with tin finish, 11°C/W natural convection, 3°C/W at 300 LFM.
Total Stock: 5,514 pcs
$ Price Range: $1.17 - $1.82

7109DG Available from 2 distributors

Authorised
Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
5,500 pcs
5500 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
14 pcs
14 pcs On Request 1 On Request On Request On Request On Request On Request

7109DG Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Tape & Reel
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width

7109DG Description

Short technical summary and product information.

The 7109DG is a top mount heat sink designed for TO-263 (D²Pak) packages. It features a rectangular finned shape and is constructed from copper with a tin finish. The heat sink measures 19.38mm in length and 25.40mm in width, with a fin height of 11.43mm (0.450").

 

Thermal performance is rated at 11.00°C/W under natural convection and 3.00°C/W at 300 LFM forced air flow. It can dissipate 2.0W at a 30°C temperature rise. The attachment method is an SMD pad, making it suitable for surface mount applications.

 

This heat sink is intended for use with TO-263 (D²Pak) packages, providing a compact thermal management solution for power devices. The copper construction offers good thermal conductivity, while the tin finish provides a solderable surface for SMD mounting.

7109DG Quick Information

Product Type: Heat Sink
Canonical Name: Top Mount Heat Sink for TO-263 (D²Pak)
Subcategory: Board Level Heat Sinks

7109DG Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

7109DG Estimated Pricing

Qty Low High
1+ $1.82 $1.82
10+ $1.65 $1.65
25+ $1.61 $1.61
50+ $1.57 $1.57
100+ $1.49 $1.49
250+ $1.41 $1.41
500+ $1.32 $1.32
1,000+ $1.26 $1.26
2,000+ $1.17 $1.17

Estimated market price range - modelled values for guidance only, not live distributor offers.

7109DG Features

  • Top mount for TO-263 packages.
  • Copper construction with tin finish.
  • 11°C/W natural convection resistance.
  • 3°C/W at 300 LFM forced air.
  • SMD pad attachment method.

7109DG Applications

  • Cooling TO-263 power devices.
  • Surface mount thermal management.
  • Natural convection cooling applications.
  • Forced air cooling at 300 LFM.

7109DG FAQs

5 frequently asked questions generated from this part’s specifications.
What is the thermal resistance of the 7109DG heat sink?

The thermal resistance is 11.00°C/W under natural convection and 3.00°C/W at 300 LFM forced air flow.

What is the power dissipation capability of the 7109DG?

The heat sink can dissipate 2.0W at a 30°C temperature rise.

What package is the 7109DG designed to cool?

The 7109DG is designed to cool TO-263 (D²Pak) packages.

What is the mounting type of the 7109DG heat sink?

The mounting type is top mount with an SMD pad attachment method.

What material is the 7109DG heat sink made of?

The heat sink is made of copper with a tin finish.

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