| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1 pcs
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1 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The TE Connectivity 7106DG/TR is a board-level heatsink specifically designed for thermal management of semiconductor devices. It is suitable for surface mounting and is intended for use with D2 Pak (TO-263) and power SO-10 (MO-184) package semiconductors.
This heatsink has a height of 9.65mm and a thermal resistance of 15.00°C/W, indicating its efficiency in dissipating heat. The component is finished with a tin plating for durability and conductivity.
Functionally, this non-electronic component is designed to withstand standard soldering and reflow processes used in semiconductor circuit assembly. Its primary role is to enhance the thermal performance of the attached semiconductor, ensuring reliable operation under load.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The height of the 7106DG/TR heatsink is 9.65mm.
The thermal resistance of the 7106DG/TR heatsink is 15.00°C/W.
The 7106DG/TR heatsink is designed for D2 Pak (TO-263) and power SO-10 (MO-184) package semiconductors.
The 7106DG/TR heatsink is a surface mount component.