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7106D/TRG Board level heat sink for TO-263, PowerSO-10, and SO-10 packages. Rated for 2.0W power dissipation with 40°C temperature rise.
Mfr Part #:

7106D/TRG

Available from 1 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Board level heat sink for TO-263, PowerSO-10, and SO-10 packages. Rated for 2.0W power dissipation with 40°C temperature rise.
✓ Total Stock: 528 pcs
$ Price Range: $3.76

7106D/TRG Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Braun Electronic Components ✓
Non-Authorised Inventory information
528 pcs
On Request
528 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

7106D/TRG Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Tape & Reel
Thermal Resistance @ Forced Air Flow
Type
Width
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7106D/TRG Description

Short technical summary and product information.

The 7106D/TRG from Aavid, Thermal Division of Boyd Corporation is a board level heat sink designed for surface mount power semiconductor packages. It features a rectangular finned shape made of copper with a tin-plated finish for excellent thermal conductivity and corrosion resistance. The heat sink measures 15.00mm in length, 25.91mm in width, and has a fin height of 0.375" (9.52mm).

 

Thermal performance is specified at 5.00°C/W under 400 LFM forced air flow, with a power dissipation capability of 2.0W at a 40°C temperature rise. The attachment method is SMD pad, allowing for efficient top mounting directly onto the PCB.

 

Compatible packages include TO-263 (D²Pak), PowerSO-10 (MO-184), and SO-10, making it suitable for cooling power MOSFETs, voltage regulators, and other power devices in forced air environments. Environmental compliance is noted as RoHS3, REACH unaffected, and MSL 1, though these are unverified and should be confirmed with the manufacturer.

7106D/TRG Quick Information

Product Type: Heat Sink
Canonical Name: Board Level Heat Sink for TO-263, Top Mount, Copper, Tin Finish
Subcategory: Board Level Heat Sink

7106D/TRG Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected
Lead Free: Yes

7106D/TRG Estimated Pricing

Qty Low High
1+ $3.76 $3.76

Estimated market price range - modelled values for guidance only, not live distributor offers.

7106D/TRG Features

  • Copper construction with tin-plated finish.
  • Top mount SMD pad attachment method.
  • Thermal resistance 5.00°C/W at 400 LFM.
  • Power dissipation 2.0W at 40°C rise.
  • Compatible with TO-263 and PowerSO-10 packages.

7106D/TRG Applications

  • Cooling power MOSFETs in D²Pak packages.
  • For use in forced air thermal management systems.
  • Surface mount assembly with SMD pads.
  • Ideal for board level power dissipation up to 2W.

7106D/TRG FAQs

5 frequently asked questions generated from this part’s specifications.
Which packages are compatible with the 7106D/TRG heat sink?

TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10.

Is the 7106D/TRG RoHS compliant?

It is listed as RoHS3 Compliant, but this is unverified. Check with manufacturer.

What is the mounting type for this heat sink?

Top mount with SMD pad attachment.

What material is the heat sink made of?

Copper with tin finish.

What is the thermal resistance at forced air flow?

5.00°C/W at 400 LFM.

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