| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,060 pcs
|
1060 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Lead Style | |
| Length | |
| Material | |
| Material Finish | |
| Mounting Type | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| Shape | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
This is a board level vertical heat sink designed for cooling TO-220 semiconductor packages. It has a rectangular shape with fins and is made of aluminum with a black anodized finish.
Key thermal specifications include a thermal resistance of 4.40°C/W under natural convection and 2.50°C/W at 400 LFM forced air flow. Power dissipation is 3.0W at a 20°C temperature rise.
The heat sink measures 49.53mm in length, 48.26mm in width, and has a fin height of 24.13mm. It attaches using both bolt-on and PC pin methods, providing secure mounting to the TO-220 package.
This component is suitable for applications requiring efficient heat dissipation from TO-220 devices in confined spaces. The black anodized finish enhances thermal emissivity and corrosion resistance.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.06 | $2.06 |
| 10+ | $1.84 | $1.84 |
| 25+ | $1.79 | $1.79 |
| 50+ | $1.75 | $1.75 |
| 100+ | $1.65 | $1.65 |
| 300+ | $1.56 | $1.56 |
| 600+ | $1.46 | $1.46 |
| 1,200+ | $1.40 | $1.40 |
| 2,700+ | $1.32 | $1.32 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-220.
4.40°C/W under natural convection and 2.50°C/W at 400 LFM forced air flow.
Length: 49.53mm, Width: 48.26mm, Fin Height: 24.13mm.
Aluminum with a black anodized finish.
Bolt-on and PC pin.
3.0W at a 20°C temperature rise.
RoHS3 compliant (unverified).