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43 pcs
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43 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Wakefield-Vette 690-3B is a board level extrusion heat sink specifically designed for cooling TO-3 semiconductor packages. Constructed from aluminum with a black anodized finish, it offers a balance of thermal performance and corrosion resistance.
Under forced air convection at 400 LFM, the heat sink achieves a thermal resistance of 2.00°C/W. It can dissipate up to 7.5W with a 44°C temperature rise above ambient. The square finned shape maximizes surface area for efficient heat transfer.
Mounting is accomplished via a bolt-on attachment method, ensuring secure mechanical and thermal contact with the TO-3 device. The compact footprint of 47.24mm x 47.24mm with a fin height of 33.27mm makes it suitable for board-level applications where space is constrained.
The 690-3B is designed to cool TO-3 packages.
The thermal resistance is 2.00°C/W at 400 LFM forced air flow.
It can dissipate 7.5W at a 44°C temperature rise.
It is made of aluminum with a black anodized finish.
It uses a bolt-on attachment method.
It is listed as RoHS3 compliant, but this is unverified.
It has a square shape with fins, dimensions 47.24mm x 47.24mm and fin height 33.27mm.