| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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86 pcs
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86 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
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| Automotive Grade | |
| Fin Height | |
| Halogen Free | |
| Industrial Grade | |
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| Material Finish | |
| Medical Grade | |
| Military Grade | |
| Mounting Type | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| SVHC Present | |
| Shape | |
| Tape & Reel | |
| Thermal Resistance @ Forced Air Flow | |
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The Wakefield-Vette 680-75A is a board level heat sink designed for cooling TO-3 power semiconductors. It is part of the 680 series, which are omnidirectional heat sinks optimized for natural convection cooling. The heat sink is constructed from aluminum with a black anodized finish, providing effective heat dissipation and corrosion resistance.
Key specifications include a square pin fin shape with dimensions of 45.97mm by 45.97mm and a fin height of 19.05mm. It offers a thermal resistance of 2.4°C/W at 400 LFM forced air flow and can dissipate 7.5W at a 58°C temperature rise in natural convection. The heat sink is mounted via a bolt-on method, ensuring secure attachment to the TO-3 package.
This heat sink is intended for vertical board mounting and is suitable for both natural and forced convection cooling. Its pin fin design allows free circulation of air, making it effective in a variety of thermal management applications.
TO-3
RoHS3 Compliant (unverified, low confidence)
2.4°C/W at 400 LFM forced air flow
7.5W at 58°C temperature rise in natural convection
Aluminum with black anodized finish
Bolt on
45.97mm square footprint, fin height 19.05mm