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4 pcs
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4 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 680-10A is a board level heat sink from Wakefield-Vette designed for cooling TO-3 packaged semiconductors. It features a square pin fin shape that provides omnidirectional heat dissipation, making it suitable for both natural and forced convection environments. The heat sink has a fin height of 25.40mm (1.000") and a 45.97mm (1.810") square footprint, allowing for compact mounting on printed circuit boards.
Constructed from aluminum with a black anodized finish, the 680-10A offers enhanced thermal emissivity and corrosion resistance. Attachment is via bolt on method, ensuring secure mechanical and thermal contact with the semiconductor device. The thermal performance is rated at 2.00°C/W typical thermal resistance at 400 LFM forced air flow, and 7.5W typical power dissipation at a 52°C temperature rise.
This heat sink is intended for use with TO-3 power packages and is commonly applied in power supplies, industrial controls, and other electronics requiring efficient heat removal. The 680 series is part of Wakefield-Vette's board level heat sink portfolio, optimized for vertical board mounting and close board-to-board spacing.
It is designed to cool the TO-3 package.
It is listed as RoHS3 compliant, but this status is unverified.
The typical thermal resistance is 2.00°C/W at 400 LFM forced air flow.
It is rated for 7.5W typical power dissipation at a 52°C temperature rise.
It is made of aluminum with a black anodized finish.