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677-25ABP Board level vertical heat sink for TO-218, TO-220, TO-247, and Multiwatt packages. Features 2.500" length, 1.650" width, and 1.000" fin height.
Mfr Part #:

677-25ABP

Available from 1 distributors
Mfr Name: Wakefield-Vette
Wakefield-Vette
Board level vertical heat sink for TO-218, TO-220, TO-247, and Multiwatt packages. Features 2.500" length, 1.650" width, and 1.000" fin height.
✓ Total Stock: 2 pcs

677-25ABP Available from 1 distributor

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✓ Non-Authorised
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Hybrid Electronics ✓
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2 pcs
On Request
2 pcs On Request 1 On Request On Request 1123 On Request On Request
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677-25ABP Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Thermal Resistance @ Forced Air Flow
Type
Width
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677-25ABP Description

Short technical summary and product information.

The Wakefield-Vette 677-25ABP is a board level, vertical heat sink designed for cooling TO-218, TO-220, TO-247, and Multiwatt semiconductor packages. It features a rectangular finned aluminum body with a black anodized finish, providing a durable and corrosion-resistant profile for thermal management in electronic assemblies.

 

The heat sink measures 63.50mm (2.500") in length, 41.91mm (1.650") in width, and has a fin height of 25.40mm (1.000"). With bolt-on and PC pin attachment options, it can be secured to the device and PCB. The vertical board-level orientation allows efficient airflow through the fins.

 

Thermal performance is characterized at 2.20°C/W under 200 LFM forced air flow, and can dissipate 6.0W at a 35°C temperature rise. These specifications make it suitable for moderate-power applications requiring reliable heat sinking on through-hole or bolt-mounted packages.

677-25ABP Quick Information

Product Type: Heat Sink
Canonical Name: Board Level Vertical Heat Sink for TO-218, TO-220, TO-247, Multiwatt Packages
Subcategory: Vertical Board Level Heat Sink

677-25ABP Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

677-25ABP Features

  • Made of black anodized aluminum.
  • Compatible with TO-218, TO-220, TO-247, Multiwatt.
  • Board level vertical heat sink.
  • Thermal resistance of 2.20°C/W at 200 LFM.
  • Dissipates 6W at a 35°C rise.

677-25ABP Applications

  • For cooling Multiwatt power semiconductors.
  • Vertical mounting in board level equipment.
  • Works with TO-220 and TO-247 packages.
  • Thermal management under forced airflow.

677-25ABP FAQs

7 frequently asked questions generated from this part’s specifications.
What semiconductor packages can the 677-25ABP heat sink cool?

It is designed to cool TO-218, TO-220, TO-247, and Multiwatt packages.

Is the 677-25ABP RoHS compliant?

Available data lists the 677-25ABP as RoHS3 compliant, but this has not yet been verified.

What is the thermal resistance of the 677-25ABP heat sink?

The thermal resistance is 2.20°C/W at 200 LFM forced air flow.

What are the dimensions of the 677-25ABP heat sink?

The heat sink is 63.50mm (2.500") long, 41.91mm (1.650") wide, with a fin height of 25.40mm (1.000").

How much power can the 677-25ABP dissipate?

It can dissipate 6.0W at a 35°C temperature rise.

What material is the 677-25ABP heat sink made of?

It is made of aluminum with a black anodized finish.

How is the 677-25ABP heat sink attached?

Attachment is via bolt-on and PC pin methods.

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