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120 pcs
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120 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Wakefield-Vette 658-25AB is a top mount heat sink specifically designed for cooling BGA packages. It is constructed from aluminum with a black anodized finish, providing durability and efficient thermal performance. The square pin fin shape measures 27.94mm (1.100 inches) on each side, with a fin height of 6.35mm (0.250 inches).
This heat sink achieves a thermal resistance of 5.00°C/W at 500 LFM forced air flow and can dissipate up to 2.0W at a 40°C temperature rise. The attachment method is via thermal tape or adhesive, which is not included with the heat sink. The package cooled is BGA, making it suitable for various BGA size applications as indicated in the manufacturer's BGA thermal solutions matrix.
The black anodized finish not only provides corrosion resistance but also enhances thermal emissivity. The pin fin design increases surface area for improved heat transfer in forced convection environments. This heat sink is part of the 658 series from Wakefield-Vette, which is recommended for 28mm x 28mm BGA footprints.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.53 | $1.53 |
| 10+ | $1.36 | $1.36 |
| 25+ | $1.29 | $1.29 |
| 50+ | $1.24 | $1.24 |
| 100+ | $1.20 | $1.20 |
| 250+ | $1.14 | $1.14 |
| 500+ | $1.10 | $1.10 |
| 1,200+ | $1.05 | $1.05 |
| 6,000+ | $0.96 | $0.96 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The 658-25AB is designed to cool BGA (Ball Grid Array) packages.
The thermal resistance is 5.00°C/W at 500 LFM forced air flow.
The heat sink measures 27.94mm x 27.94mm (1.100 inches square) with a fin height of 6.35mm (0.250 inches).
It is made of aluminum with a black anodized finish.
It is attached using thermal tape or adhesive, which are not included with the heat sink.
The RoHS status is listed as RoHS3 Compliant, but this is unverified as the part number does not have the 'E' suffix used by Wakefield-Vette for RoHS compliant variants.
It can dissipate 2.0W at a 40°C temperature rise.