| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,700 pcs
|
1700 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Wakefield-Vette 651-B is a board-level heat sink specifically designed for cooling 14-DIP and 16-DIP integrated circuit packages. Constructed from black anodized aluminum, it provides effective thermal management in a compact form factor.
This heat sink measures 19.05mm in length, 10.54mm in width, and has a fin height of 6.10mm. It is designed for top mounting and uses thermal tape or adhesive for attachment, though these materials are not included with the part. The rectangular finned shape increases the surface area for heat dissipation.
Under forced air convection at 300 LFM, the 651-B achieves a typical thermal resistance of 40.00°C/W. It is rated for a nominal power dissipation of 0.5W at a 40°C temperature rise, making it suitable for low-power DIP devices requiring supplemental cooling.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.31 | $1.31 |
| 10+ | $1.16 | $1.16 |
| 25+ | $1.10 | $1.10 |
| 50+ | $1.06 | $1.06 |
| 100+ | $1.02 | $1.02 |
| 250+ | $0.97 | $0.97 |
| 500+ | $0.94 | $0.94 |
| 4,900+ | $0.83 | $0.83 |
| 9,800+ | $0.80 | $0.80 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The 651-B is designed to cool 14-DIP and 16-DIP packages.
The typical thermal resistance is 40.00°C/W at 300 LFM forced air.
It is made from aluminum with a black anodized finish.
The length is 19.05mm, the width is 10.54mm, and the fin height is 6.10mm.
It uses thermal tape or adhesive for attachment, which is not included.
The nominal power dissipation is 0.5W at a 40°C temperature rise.