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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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100 pcs
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100 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
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| Automotive Grade | |
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| Medical Grade | |
| Military Grade | |
| Package Cooled | |
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The Wakefield-Vette 637-20ABP is a board-level heat sink designed for TO-220 semiconductor packages. It features a vertical mounting orientation and a rectangular finned shape, constructed from aluminum with a black anodized finish for enhanced heat dissipation and corrosion resistance.
With a thermal resistance of 9.2°C/W under natural convection and 4.7°C/W at 200 LFM forced airflow, this heat sink provides effective cooling for moderate power dissipation. It is rated for 6.0W power dissipation at a 55°C temperature rise, making it suitable for a range of power management and amplification applications.
The heat sink measures 50.80mm in length, 34.93mm in width, and has a fin height of 12.70mm. It can be attached using both bolt-on and PC pin methods, offering flexibility in mounting to PCBs or chassis. The black anodized finish improves thermal performance and provides a professional appearance.
The thermal resistance is 9.2°C/W under natural convection and 4.7°C/W at 200 LFM forced airflow.
It can dissipate 6.0W at a 55°C temperature rise.
It is designed for TO-220 packages.
The heat sink measures 50.80mm in length, 34.93mm in width, and has a fin height of 12.70mm.
It is made of aluminum with a black anodized finish.
It can be attached using bolt-on and PC pin methods.