| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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15 pcs
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15 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Wakefield-Vette 623A is a board level heat sink designed for cooling TO-3 semiconductor packages. Constructed from aluminum alloy with a black anodized finish, this heat sink provides effective thermal management in forced air applications.
Key specifications include a thermal resistance of 1.50°C/W at 250 LFM forced air flow and a power dissipation rating of 15.0W at a 52°C temperature rise. The heat sink measures 120.65mm (4.750") in width, 76.20mm (3.000") in length, and has a fin height of 11.70mm (0.461").
The rectangular fin shape maximizes surface area for heat dissipation. The press fit attachment method allows for secure mounting to the TO-3 package without additional hardware. This heat sink is suitable for use in various electronic systems requiring reliable thermal management of TO-3 devices.
| Qty | Low | High |
|---|---|---|
| 250+ | $4.48 | $4.48 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 1.50°C/W at 250 LFM forced air flow.
The power dissipation is 15.0W at a 52°C temperature rise.
It is designed to cool TO-3 packages.
It is made from aluminum alloy with a black anodized finish.
The width is 120.65mm (4.750"), length is 76.20mm (3.000"), and fin height is 11.70mm (0.461").
It uses a press fit attachment method.
RoHS compliance is listed as RoHS3 compliant but is unverified.