| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,000 pcs
|
1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Length | |
| Material | |
| Material Finish | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| Shape | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
The 6025DG is a board-level vertical heat sink designed for cooling TO-220 semiconductor packages. Manufactured by Aavid, Thermal Division of Boyd Corporation, it is made of copper with a tin finish for corrosion resistance and solderability.
Key thermal specifications include a natural convection thermal resistance of 17.9°C/W and a forced air thermal resistance of 7.0°C/W at 400 LFM. It can dissipate up to 3.0W at a 60°C temperature rise.
The heat sink measures 31.75mm in length, 22.23mm in width, and has a fin height of 6.35mm. It features a rectangular shape with fins and uses a bolt-on and PC pin attachment method for secure mounting to the TO-220 package.
This heat sink is suitable for applications requiring efficient thermal management in confined spaces. Its vertical orientation allows for natural airflow, and the staggered fin design enhances heat dissipation.
| Qty | Low | High |
|---|---|---|
| 1+ | $3.05 | $3.05 |
| 10+ | $2.69 | $2.69 |
| 25+ | $2.57 | $2.57 |
| 50+ | $2.47 | $2.47 |
| 100+ | $2.35 | $2.35 |
| 250+ | $2.22 | $2.22 |
| 500+ | $2.11 | $2.11 |
| 1,200+ | $2.00 | $2.00 |
| 2,400+ | $1.95 | $1.95 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-220
17.9°C/W
7.0°C/W
Copper with tin finish
3.0W at 60°C temperature rise
Bolt on and PC pin
RoHS3 Compliant (unverified)