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30 pcs
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30 pcs | On Request | 1 | On Request | On Request | NO DC | On Request | On Request |
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The 6021PBG from Aavid, Thermal Division of Boyd Corporation is a heat sink specifically designed for TO-220 packages. It features a through-hole mounting style for secure integration into electronic assemblies.
This heat sink provides a thermal resistance of 12.5 °C/W under natural convection conditions, making it suitable for dissipating heat from electronic components. For applications requiring enhanced cooling, it offers a thermal resistance of 6 °C/W at 300 LFM of forced airflow. The dimensions of the heat sink are 25.4 mm in length, 12.7 mm in width, and 29.972 mm in height, with an outline of 25.40mm x 12.70mm.
The attachment method is described as Bolt On and PC Pin, ensuring versatile mounting options. The material is aluminum, chosen for its effective thermal conductivity. This component is RoHS3 compliant, MSL 1, and REACH unaffected, indicating adherence to environmental standards.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.00 | $2.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 12.5 °C/W under natural convection and 6 °C/W at 300 LFM of forced airflow.
It is designed for TO-220 packages.
The dimensions are 25.4 mm in length, 12.7 mm in width, and 29.972 mm in height.
It features a through-hole mounting style and can be attached via Bolt On and PC Pin methods.