| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
8,000 pcs
|
8000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 6021BG is a board level vertical heat sink manufactured by Aavid, Thermal Division of Boyd Corporation. It is specifically designed for cooling TO-220 semiconductor packages.
Mechanically, the heat sink is made of black anodized aluminum with dimensions of 29.97mm length, 25.40mm width, and a fin height of 12.70mm. It features a rectangular fin shape and is attached using bolt-on and PC pin methods.
Thermally, the component offers a thermal resistance of 12.50°C/W under natural convection and 5.00°C/W at 500 LFM forced air flow. It can dissipate up to 2.0W at a 30°C temperature rise.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.81 | $1.81 |
| 10+ | $1.65 | $1.65 |
| 25+ | $1.60 | $1.60 |
| 50+ | $1.56 | $1.56 |
| 100+ | $1.47 | $1.47 |
| 250+ | $1.39 | $1.39 |
| 500+ | $1.31 | $1.31 |
| 1,000+ | $1.03 | $1.03 |
| 2,000+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The heat sink is designed for TO-220 packages.
The thermal resistance under natural convection is 12.50°C/W.
The fin height is 12.70mm (0.500 inches).
The heat sink is made of aluminum with a black anodized finish.
It can be attached using bolt-on and PC pin methods.
The RoHS status is listed as RoHS3 Compliant, but this is unverified from the manufacturer.