| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
251 pcs
|
251 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Backing, Carrier | |
| Color | |
| Material | |
| Military Grade | |
| Outline | |
| Shape | |
| Thermal Conductivity | |
| Thickness | |
| Type | |
| Usage |
This thermal pad from Parker Chomerics is a rectangular sheet designed for TO-220 packages. It measures 18.03mm x 12.7mm with a thickness of 0.381mm (0.0150"). The pad is made of acrylic material with a fiberglass backing, providing a durable and electrically insulating layer. It is white in color and has a thermal conductivity of 2.6W/m-K.
The pad is intended for use between a TO-220 semiconductor and a heatsink to facilitate heat transfer while maintaining electrical isolation. The fiberglass carrier enhances mechanical strength and dimensional stability. The acrylic base offers good thermal coupling and conformability to component surfaces.
This product falls under the Thermal Management category, specifically Pads, Sheets. It is commonly used in power electronics and other applications where TO-220 components require thermal management. The rectangular shape and precise dimensions make it suitable for standard mounting configurations.
| Qty | Low | High |
|---|---|---|
| 1+ | $3.01 | $3.01 |
| 10+ | $2.72 | $2.72 |
| 25+ | $2.62 | $2.62 |
| 50+ | $2.50 | $2.50 |
| 100+ | $2.38 | $2.38 |
| 250+ | $2.25 | $2.25 |
| 500+ | $2.17 | $2.17 |
| 1,000+ | $2.08 | $2.08 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal conductivity is 2.6 W/m-K.
The outline is 18.03mm x 12.70mm.
The thickness is 0.381mm (0.0150").
The pad is made of acrylic with a fiberglass backing.
It is used for TO-220 packages.
The pad is listed as RoHS3 Compliant.
The pad is rectangular.