Mfr Part #:

60-11-4659-1671

Round acrylic insulator pad with fiberglass carrier, 15.88mm diameter, 0.381mm thickness, thermal conductivity 2.6W/m-K, designed for DO-4 packages.

✓ Total Stock: 4 pcs

$ Price Range: $2.70 - $3.89

60-11-4659-1671 Available from 1 distributor

✓ Authorised

✓ Non-Authorised

Distributor		Stock	Pricing	MOQ	PKG	Lead Time	Date Code	On Order Quantity	On Order Delivery
ADI/AAR OEM Supply ✓ Non-Authorised Inventory information	4 pcs On Request	4 pcs	On Request	1	On Request	On Request	On Request	On Request	On Request

60-11-4659-1671 Description

Short technical summary and product information.

The 60-11-4659-1671 is a round thermal insulator pad from Parker Chomerics. It is made of acrylic material with a fiberglass carrier, providing electrical insulation and thermal conduction. The pad has a diameter of 15.88mm and a thickness of 0.381mm, with a thermal conductivity of 2.6 W/m-K. It is designed for use with DO-4 semiconductor packages. The white color and round shape facilitate easy identification and placement. This pad is suitable for thermal management applications where electrical isolation is required between a heat sink and a semiconductor device.

60-11-4659-1671 Quick Information

Product Type: Insulator Pad, Sheet

Canonical Name: Acrylic Insulator Pad, Sheet with Fiberglass Carrier, Round, 15.88mm Diameter, 0.381mm Thickness, for DO-4

Subcategory: Thermal Pads

60-11-4659-1671 Compliance

RoHS Status: RoHS Compliant

Moisture Sensitivity Level (MSL): 1 Unlimited

REACH Status: REACH Unaffected

60-11-4659-1671 Estimated Pricing

Qty	Low	High
1+	$3.89	$3.89
10+	$3.54	$3.54
25+	$3.41	$3.41
50+	$3.25	$3.25
100+	$3.09	$3.09
250+	$2.92	$2.92
500+	$2.82	$2.82
1,000+	$2.70	$2.70

Estimated market price range - modelled values for guidance only, not live distributor offers.

60-11-4659-1671 Features

Round acrylic insulator pad for DO-4.
15.88mm diameter, 0.381mm thickness.
Thermal conductivity of 2.6 W/m-K.
Fiberglass carrier for added strength.
White color for easy identification.

60-11-4659-1671 Applications

Thermal management of DO-4 semiconductor packages.
Electrical isolation between device and heat sink.
Use in power supply and motor control circuits.
Ideal for industrial and automotive electronics.

60-11-4659-1671 FAQs

7 frequently asked questions generated from this part’s specifications.

What is the RoHS compliance status of this part?

The part is listed as RoHS3 compliant, but this status is unverified.

What is the thermal conductivity of the 60-11-4659-1671?

2.6 W/m-K.

What is the diameter of this insulator pad?

15.88 mm.

What is the thickness?

0.381 mm (0.0150 inches).

What material is the pad made of?

Acrylic with a fiberglass carrier.

What package type is this pad designed for?

DO-4.

What is the color of the pad?

White.