| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,505 pcs
|
2505 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This SoC from Intel combines a dual ARM Cortex-A9 MPCore processor with an FPGA fabric containing 85,000 logic elements. The processor operates at 800MHz, with 64KB of internal RAM. It is designed for embedded systems requiring both high-performance processing and programmable logic.
Connectivity options include CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, and memory interfaces for EBI/EMI and MMC/SD/SDIO. Peripherals include DMA, POR, and WDT. Operating temperature range is -40°C to 100°C.
The device is housed in a 896-ball BGA package with a 31mm x 31mm FBGA footprint. It is supplied in a 896-FBGA package. The part is listed as RoHS3 compliant and REACH unaffected.
-40°C to 100°C (TJ).
896-BGA with supplier device package 896-FBGA (31x31).
The part is reported as RoHS3 Compliant.
Dual ARM Cortex-A9 MPCore at 800MHz.
85K logic elements.
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
MSL 1 (Unlimited).