| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1,000 pcs
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1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel 5AGXMB3G6F31C6N is a high-density Field Programmable Gate Array (FPGA) designed for a wide range of embedded applications. It integrates 362,000 logic elements organized into 17,110 logic array blocks (LABs), providing substantial programmable logic resources. The device also includes 19,822,592 bits of embedded RAM and 384 user I/O pins for flexible connectivity.
Operating from a supply voltage of 1.07V to 1.13V, the FPGA is specified for a junction temperature range of 0°C to 85°C. It is housed in a 896-BBGA/FCBGA package with a supplier device package of 896-FBGA (31x31), suitable for surface mount assembly. The device is RoHS3 compliant and has an MSL of Level 1 (unlimited floor life), though these compliance values are unverified.
This FPGA is suitable for applications requiring high logic density and moderate I/O count, such as industrial control, telecommunications, and data processing. The large number of logic elements and LABs enables complex digital designs, while the embedded RAM supports on-chip data buffering and storage.
362,000 logic elements.
384 I/O pins.
1.07V to 1.13V.
896-FBGA (31x31) surface mount package.
0°C to 85°C (junction temperature).
19,822,592 bits (19.8 Mbit).
17,110 LABs.