| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,000 pcs
|
1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Total RAM Bits | |
| Voltage |
The Intel 5AGXBB3D4F31C5N is a high-density Field Programmable Gate Array (FPGA) featuring 362,000 logic elements, 17,110 Logic Array Blocks (LABs), and 19,822,592 bits of embedded RAM. It provides 384 user I/O pins for flexible connectivity. The device operates from a core supply voltage of 1.07V to 1.13V and is specified for a temperature range of 0°C to 85°C. Housed in a 896-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 31x31 mm, it is designed for surface mount assembly. This FPGA is suitable for complex digital logic designs requiring significant on-chip memory and high I/O count.
362,000 logic elements.
384 I/O pins.
1.07V to 1.13V.
896-BBGA, FCBGA with supplier device package 896-FBGA (31x31).
19,822,592 bits (approximately 19.8 Mbits).
0°C to 85°C (TJ).
17,110 LABs.