| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,032 pcs
|
2032 pcs | On Request | 1 | On Request | On Request | 20+ | On Request | On Request |
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The Intel 5AGTFD3H3F35I3G is a field-programmable gate array (FPGA) designed for high-performance embedded applications. It features 362,000 logic elements and 17110 logic array blocks (LABs/CLBs), providing ample resources for complex digital logic designs. The device offers 544 user I/O pins for flexible interfacing with external components.
The FPGA operates with a supply voltage range of 1.12V to 1.18V and has a total RAM capacity of 19,822,592 bits for on-chip data storage. It is rated for industrial temperature ranges from -40°C to 100°C (junction), making it suitable for environments with extended thermal requirements.
The device is packaged in a 1152-ball BGA package (1152-BBGA, FCBGA) with a surface mount mounting type. The supplier device package is 1152-FBGA, FC (35x35). The package size is 35mm x 35mm, which is typical for high-pin-count FPGAs. This package enables high-density interconnect while maintaining good thermal dissipation.
This FPGA is RoHS3 compliant and has a moisture sensitivity level (MSL) of 1 (unlimited), indicating no special handling requirements for moisture exposure. The REACH status is unaffected. These compliance credentials facilitate integration into global electronic designs.
The FPGA has 362,000 logic elements.
The device has 544 I/O pins.
The supply voltage range is 1.12V to 1.18V.
The package is 1152-BBGA, FCBGA (1152-FBGA, FC (35x35) supplier package).
The operating temperature range is -40°C to 100°C (junction).
Surface mount.
Total RAM bits are 19,822,592 (approximately 19.8 Mbits).