| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
21 pcs
|
21 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Style | |
| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Lead Style | |
| Memory Type | |
| Mounting Feature | |
| Mounting Type | |
| Number of Positions | |
| Standards | |
| Tape & Reel |
The TE Connectivity 5822134-3 is a 72-position SIMM (Single In-line Memory Module) socket designed for through-hole mounting at a 22° angle. It is part of the inline module socket category and is suitable for RAM memory module applications. The connector features tin-plated contacts with a thickness of 200.0µin (5.08µm), ensuring reliable electrical connections. It includes board guide and latches for secure module retention. The socket conforms to the MO-116 standard. The mounting feature is normal, standard - top. This connector is RoHS3 compliant and REACH unaffected, with an MSL of 1 (unlimited). The through-hole mounting with a 22° angle allows for efficient PCB layout and module insertion. The tin contact finish provides good solderability and corrosion resistance. The board guide aids in alignment during assembly, and the latches ensure the memory module stays firmly in place.
| Qty | Low | High |
|---|---|---|
| 1+ | $6.84 | $6.84 |
| 10+ | $6.25 | $6.25 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
72 positions.
Through hole, 22° angle.
Tin with a thickness of 200.0µin (5.08µm).
Yes, it includes board guide and latches.
MO-116.
RoHS3 Compliant.
MSL 1 (Unlimited).