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581101B02500G Board level vertical heat sink for TO-218 packages, made of aluminum with black anodized finish, offering 16.8°C/W thermal resistance under natural convection.
Mfr Part #:

581101B02500G

Available from 1 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Board level vertical heat sink for TO-218 packages, made of aluminum with black anodized finish, offering 16.8°C/W thermal resistance under natural convection.
✓ Total Stock: 600 pcs

581101B02500G Available from 1 distributor

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✓ Non-Authorised
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Braun Electronic Components ✓
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600 pcs
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600 pcs On Request 1 On Request On Request On Request On Request On Request
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581101B02500G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width
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581101B02500G Description

Short technical summary and product information.

The Aavid 581101B02500G is a board level, vertical heat sink designed for cooling TO-218 semiconductor packages. It measures 38.10mm in length and 16.26mm in width with a fin height of 16.26mm, providing efficient heat dissipation in a compact form factor.

 

Constructed from aluminum with a black anodized finish, this heat sink offers a thermal resistance of 16.80°C/W under natural convection and improves to 5.00°C/W at 200 LFM forced airflow. It has a typical power dissipation of 3.0W at a 50°C temperature rise.

 

Attachment is via bolt-on and PC pin methods, making it suitable for both permanent and removable mounting on printed circuit boards. The rectangular fin geometry optimizes surface area for convective heat transfer.

581101B02500G Quick Information

Product Type: Heat Sink
Canonical Name: Board Level, Vertical Heat Sink for TO-218
Subcategory: Vertical Heat Sinks

581101B02500G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

581101B02500G Features

  • Board level vertical heat sink design.
  • For TO-218 semiconductor packages.
  • Aluminum construction with black anodized finish.
  • 16.80°C/W thermal resistance at natural convection.
  • Bolt-on and PC pin attachment method.

581101B02500G Applications

  • Cooling TO-218 power transistors and regulators.
  • General purpose board level thermal management.
  • Vertical orientation for natural or forced convection.
  • Power dissipation up to 3.0W at 50°C rise.

581101B02500G FAQs

7 frequently asked questions generated from this part’s specifications.
What semiconductor package is this heat sink designed for?

This heat sink is designed for the TO-218 package.

What is the thermal resistance of this heat sink?

Typical thermal resistance is 16.80°C/W under natural convection and 5.00°C/W at 200 LFM forced air flow.

What material and finish does this heat sink have?

It is made of aluminum with a black anodized finish.

What are the dimensions of the 581101B02500G heat sink?

Length is 38.10mm, width is 16.26mm, and fin height is 16.26mm.

How is this heat sink attached to the component or board?

It uses bolt-on and PC pin attachment methods.

What is the power dissipation capability of this heat sink?

Typical power dissipation is 3.0W at a 50°C temperature rise.

Is this heat sink RoHS compliant?

RoHS3 compliant status is reported but unverified from manufacturer documentation.

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