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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1 pcs
|
1 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Halogen Free | |
| Length | |
| Material | |
| Material Finish | |
| Mounting Type | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| SVHC Present | |
| Shape | |
| Tape & Reel | |
| Termination Style | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
This heat sink is designed for cooling TO-220 semiconductor packages in board level applications. It is constructed from aluminum with a black anodized finish, providing corrosion resistance and enhanced thermal emissivity. The heat sink measures 16.26mm in width, 25.40mm in length, and has a fin height of 16.26mm, making it suitable for vertical mounting on PCBs.
Thermal performance: natural convection thermal resistance is 17.4°C/W, improving to 4.00°C/W with 500 LFM forced air flow. Maximum power dissipation is 2.5W for a 50°C temperature rise. Attachment is achieved via bolt-on or PC pin methods, offering flexibility in assembly.
Typical applications include power supplies, motor drives, and voltage regulators where efficient thermal management of TO-220 devices is required. The vertical orientation allows natural airflow, and the black anodized surface aids in heat radiation.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.05 | $2.05 |
| 10+ | $1.84 | $1.84 |
| 25+ | $1.77 | $1.77 |
| 50+ | $1.70 | $1.70 |
| 100+ | $1.64 | $1.64 |
| 250+ | $1.56 | $1.56 |
| 500+ | $1.46 | $1.46 |
| 810+ | $1.40 | $1.40 |
| 2,430+ | $1.31 | $1.31 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-220
17.4°C/W
4.00°C/W
2.5W
Width 16.26mm, length 25.40mm, fin height 16.26mm.
Aluminum with black anodized finish.
RoHS3 Compliant