| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
20,000 pcs
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20000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
1,008 pcs
|
1008 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Package Cooled | |
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The 577202B00000G is a board level heat sink designed for cooling TO-220 semiconductor packages. It is constructed from aluminum with a black anodized material finish, providing corrosion resistance and improved thermal emissivity. The heat sink has a rectangular shape with fins, measuring 19.05mm in length, 13.21mm in width, and a fin height of 12.70mm (0.500"). Attachment is via bolt-on mounting, making it suitable for permanent or semi-permanent installation.
Thermal performance is specified at 24.40°C/W under natural convection and 10.00°C/W at 200 LFM forced air flow, demonstrating significant improvement with active cooling. The heat sink can dissipate up to 1.5W at a 40°C temperature rise. This makes it appropriate for low-to-moderate power applications where TO-220 devices require thermal management in confined spaces.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.56 | $0.56 |
| 10+ | $0.50 | $0.50 |
| 25+ | $0.47 | $0.47 |
| 50+ | $0.45 | $0.45 |
| 100+ | $0.44 | $0.44 |
| 250+ | $0.42 | $0.42 |
| 500+ | $0.40 | $0.40 |
| 1,000+ | $0.38 | $0.38 |
| 5,000+ | $0.35 | $0.35 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is designed for the TO-220 package.
The thermal resistance is 24.40°C/W under natural convection and 10.00°C/W at 200 LFM forced air flow.
It can dissipate 1.5W at a 40°C temperature rise.
It is made of aluminum with a black anodized finish.
It is attached via bolt-on mounting.
Length is 19.05mm, width is 13.21mm, and fin height is 12.70mm (0.500").
RoHS status is listed as RoHS3 Compliant, but this data is unverified and low confidence.