576802B03100G Board level heat sink for TO-220 and TO-262 packages. Aluminum with black anodized finish, 27.30°C/W natural thermal resistance, attaches via clip and PC pin.
Mfr Part #:

576802B03100G

Available from 2 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Board level heat sink for TO-220 and TO-262 packages. Aluminum with black anodized finish, 27.30°C/W natural thermal resistance, attaches via clip and PC pin.
Total Stock: 1,971 pcs
$ Price Range: $0.53 - $0.84

576802B03100G Available from 2 distributors

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Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
1,940 pcs
1940 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
31 pcs
31 pcs On Request 1 On Request On Request On Request On Request On Request

576802B03100G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Lead Style
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Termination Style
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width

576802B03100G Description

Short technical summary and product information.

The 576802B03100G is a board-level heat sink designed for cooling TO-220 and TO-262 semiconductor packages. Manufactured by Aavid, it features an aluminum construction with a black anodized finish for enhanced thermal emissivity.

 

Key thermal specifications include a natural convection thermal resistance of 27.30°C/W and 7.00°C/W at 400 LFM forced airflow, with a power dissipation rating of 1.0W at a 30°C temperature rise. Mechanical dimensions are 12.70mm fin height, 12.70mm width, and 19.05mm length, with a rectangular fin shape.

 

The heat sink attaches using a clip and PC pin mounting method, making it suitable for horizontal plug-in PCB layouts. It is compatible with both TO-220 and TO-262 package styles and is intended for low-power thermal management applications such as voltage regulators and power transistors.

576802B03100G Quick Information

Product Type: Board Level Heat Sink
Canonical Name: Board Level Heat Sink, Rectangular Fins, TO-220/TO-262, Black Anodized Aluminum

576802B03100G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

576802B03100G Estimated Pricing

Qty Low High
1+ $0.84 $0.84
10+ $0.74 $0.74
25+ $0.71 $0.71
50+ $0.69 $0.69
100+ $0.66 $0.66
250+ $0.62 $0.62
500+ $0.60 $0.60
1,000+ $0.58 $0.58
4,000+ $0.53 $0.53

Estimated market price range - modelled values for guidance only, not live distributor offers.

576802B03100G Features

  • Aluminum board-level heat sink for TO-220/262.
  • Black anodized finish for improved thermal emissivity.
  • 27.30°C/W natural convection thermal resistance.
  • Attaches via clip and PC pin mounting.
  • 1.0W power dissipation at 30°C rise.

576802B03100G Applications

  • Used for cooling TO-220 power transistors.
  • Suitable for low-power linear regulators.
  • Ideal for board-level power supply circuits.
  • Fits TO-262 packages in space-constrained designs.

576802B03100G FAQs

7 frequently asked questions generated from this part’s specifications.
What packages does this heat sink cool?

It is designed for TO-220 and TO-262 packages.

What is the thermal resistance of this heat sink?

Natural convection: 27.30°C/W typical. Forced air at 400 LFM: 7.00°C/W typical.

What are the dimensions of this heat sink?

Fin height: 12.70mm, width: 12.70mm, length: 19.05mm.

What material is the heat sink made of?

Aluminum with a black anodized finish.

How is the heat sink attached to the board?

Using a clip and PC pin mounting method.

Is this heat sink RoHS compliant?

The part is listed as RoHS3 compliant, but this is unverified and should be treated as low confidence.

What is the power dissipation rating?

1.0W typical at a 30°C temperature rise.

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