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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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5 pcs
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5 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
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The 575002B00000G is a board level vertical heat sink designed for TO-220 semiconductor packages. It is constructed from aluminum with a black anodized finish, offering a rectangular finned shape for efficient heat dissipation. The heat sink measures 25.40mm in width, 29.97mm in length, and has a fin height of 12.70mm.
Thermal performance is specified at 5.00°C/W under forced air flow of 400 LFM and 13.60°C/W under natural convection. It can dissipate 1.0W at a 20°C temperature rise. The attachment method includes bolt-on and PC pin options, making it suitable for vertical mounting on PCBs.
This heat sink is intended for thermal management in electronic assemblies where TO-220 devices need cooling. The black anodized finish enhances both thermal emissivity and corrosion resistance. The compact size and board-level design make it appropriate for space-constrained applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.37 | $1.37 |
| 10+ | $1.23 | $1.23 |
| 100+ | $1.20 | $1.20 |
| 250+ | $1.14 | $1.14 |
| 2,000+ | $1.13 | $1.13 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 5.00°C/W under forced air flow at 400 LFM and 13.60°C/W under natural convection.
It can dissipate 1.0W at a temperature rise of 20°C.
The heat sink is 25.40mm wide, 29.97mm long, and has a fin height of 12.70mm.
It uses bolt-on and PC pin attachment methods.
It is made of aluminum with a black anodized finish.