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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
224 pcs
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224 pcs | On Request | 1 | On Request | On Request | 2011-07-29 | On Request | On Request |
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The 574902B03700G is a board level vertical heat sink designed for cooling TO-220 packages. It features a rectangular finned shape and is constructed from black anodized aluminum, providing effective heat dissipation in a compact form factor.
With dimensions of 34.93mm length, 21.84mm width, and 10.03mm fin height, this heat sink offers a thermal resistance of 6.00°C/W under forced air flow at 400 LFM and 16.00°C/W under natural convection. It can dissipate up to 2.5W at a 40°C temperature rise.
The heat sink attaches to the component using a clip and PC pin method, ensuring secure mounting on the PCB. Its vertical orientation is suitable for applications where airflow direction aligns with the fins for optimal cooling performance.
| Qty | Low | High |
|---|---|---|
| 10,500+ | $3.37 | $3.37 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 6.00°C/W at 400 LFM forced air flow and 16.00°C/W under natural convection.
It can dissipate 2.5W at a 40°C temperature rise.
It is designed for TO-220 packages.
The length is 34.93mm, width is 21.84mm, and fin height is 10.03mm.
It is made of aluminum with a black anodized finish.
It uses a clip and PC pin attachment method.