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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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44 pcs
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44 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 574502B03300G is a board level, vertical heat sink designed for cooling TO-220 semiconductor packages. It is manufactured by Aavid, Thermal Division of Boyd Corporation, and features an aluminum construction with a black anodized finish.
The heat sink has a rectangular shape with fins, measuring 19.05mm in length, 20.57mm in width, and a fin height of 9.91mm. It offers a thermal resistance of 21.20°C/W in natural convection, and 6.00°C/W at 600 LFM forced air flow. The power dissipation is rated at 3.0W for a 60°C temperature rise.
The attachment method uses a clip and PC pin, allowing secure mounting to the TO-220 package and PCB. This vertical orientation is suitable for space-constrained designs where airflow is available.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.43 | $0.43 |
| 10+ | $0.38 | $0.38 |
| 25+ | $0.37 | $0.37 |
| 50+ | $0.35 | $0.35 |
| 100+ | $0.35 | $0.35 |
| 250+ | $0.33 | $0.33 |
| 500+ | $0.31 | $0.31 |
| 1,000+ | $0.30 | $0.30 |
| 2,000+ | $0.28 | $0.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The heat sink is designed for the TO-220 package.
Natural convection: 21.20°C/W. Forced air (600 LFM): 6.00°C/W.
Aluminum with a black anodized finish.
Clip and PC Pin.
RoHS3 Compliant (unverified).
3.0W typical at 60°C temperature rise.
Length: 19.05mm, Width: 20.57mm, Fin Height: 9.91mm.