| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1,200 pcs
|
1200 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 574502B00000G is a board level heat sink designed for cooling TO-220 semiconductor packages. It is constructed from aluminum with a black anodized finish for corrosion resistance and improved thermal emissivity. The heat sink measures 19.05mm in length, 21.84mm in width, with a fin height of 10.03mm. It attaches to the TO-220 device using a clip, ensuring secure mechanical contact.
Thermal performance is rated at 21.2°C/W under natural convection and 8.0°C/W at 400 LFM forced air flow. Maximum power dissipation is 3.0W at a 60°C temperature rise. This heat sink is suitable for applications requiring efficient thermal management in confined spaces.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.43 | $0.43 |
| 10+ | $0.39 | $0.39 |
| 25+ | $0.38 | $0.38 |
| 50+ | $0.37 | $0.37 |
| 100+ | $0.36 | $0.36 |
| 250+ | $0.35 | $0.35 |
| 500+ | $0.32 | $0.32 |
| 1,000+ | $0.31 | $0.31 |
| 3,000+ | $0.28 | $0.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-220.
Aluminum with black anodized finish.
21.2°C/W.
8.0°C/W.
3.0W at 60°C temperature rise.
Length 19.05mm, width 21.84mm, fin height 10.03mm.
RoHS3 Compliant (unverified).