| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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18,000 pcs
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18000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 573902B04000G is a board-level heat sink from Aavid, Thermal Division of Boyd Corporation, designed specifically for TO-220 semiconductor packages. It features a rectangular fin geometry with a black anodized aluminum finish for efficient heat dissipation.
Key thermal specifications include a thermal resistance of 18.80°C/W under natural convection and 7.00°C/W at 200 LFM forced air flow. The heat sink can dissipate up to 3.0W at a 60°C temperature rise. Its dimensions are 38.10mm length, 12.70mm width, and 12.70mm fin height.
The attachment method uses a clip and PC pin, allowing secure mounting directly to the PCB. This vertical orientation heat sink is suitable for both natural and forced convection environments, making it versatile for various thermal management applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.19 | $4.19 |
| 10+ | $4.08 | $4.08 |
| 25+ | $3.93 | $3.93 |
| 50+ | $3.83 | $3.83 |
| 100+ | $3.74 | $3.74 |
| 250+ | $3.66 | $3.66 |
| 500+ | $2.44 | $2.44 |
| 1,000+ | $2.43 | $2.43 |
| 2,000+ | $2.21 | $2.21 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is designed for TO-220 packages.
18.80°C/W in natural convection and 7.00°C/W at 200 LFM forced air flow.
3.0W at a 60°C temperature rise.
Length 38.10mm, width 12.70mm, fin height 12.70mm.
Aluminum with black anodized finish.
RoHS3 Compliant (unverified).
Clip and PC pin.