573400D00010G Top mount heat sink for TO-268 (D3Pak) packages. Copper base with tin plating, SMD attachment, provides 14.00°C/W thermal resistance in natural convection.
Mfr Part #:

573400D00010G

Available from 3 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Top mount heat sink for TO-268 (D3Pak) packages. Copper base with tin plating, SMD attachment, provides 14.00°C/W thermal resistance in natural convection.
Total Stock: 3,292 pcs
$ Price Range: $0.86 - $1.18

573400D00010G Available from 3 distributors

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Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
3,000 pcs
3000 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
190 pcs
190 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
102 pcs
102 pcs On Request 1 On Request On Request On Request On Request On Request

573400D00010G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Lead Style
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width

573400D00010G Description

Short technical summary and product information.

The 573400D00010G is a top mount heat sink designed for TO-268 (D3Pak) packages. It features a rectangular fin shape with a copper base and tin plating for corrosion resistance. The SMD pad attachment method allows for surface mount assembly.

 

Thermal performance: 14.00°C/W typical in natural convection, and 4.00°C/W at 600 LFM forced air flow. Power dissipation is 1.0W typical at 20°C temperature rise.

 

Dimensions: 30.99mm width, 12.70mm length, 10.20mm fin height. The copper material provides efficient heat transfer. This heat sink is RoHS3 compliant, REACH unaffected, and has MSL 1 rating.

573400D00010G Quick Information

Product Type: Heat Sink
Canonical Name: Heat Sink for TO-268 (D3Pak), Top Mount, SMD, Copper/Tin
Subcategory: Board Level Heat Sinks

573400D00010G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected
Lead Free: Yes

573400D00010G Estimated Pricing

Qty Low High
1+ $1.18 $1.18
10+ $1.10 $1.10
25+ $1.08 $1.08
50+ $1.07 $1.07
250+ $1.02 $1.02
500+ $0.96 $0.96
1,000+ $0.92 $0.92
1,500+ $0.86 $0.86

Estimated market price range - modelled values for guidance only, not live distributor offers.

573400D00010G Features

  • Top mount heatsink for TO-268 D3Pak.
  • Copper base with tin plating finish.
  • SMD pad attachment for surface mount.
  • 14.00°C/W natural convection thermal resistance.
  • 4.00°C/W thermal resistance at 600 LFM.

573400D00010G Applications

  • Cooling TO-268 (D3Pak) power semiconductors.
  • Used in power supplies and converters.
  • Suitable for forced air and natural convection.

573400D00010G FAQs

7 frequently asked questions generated from this part’s specifications.
What package does this heat sink cool?

It is designed for TO-268 (D3Pak) packages.

What is the thermal resistance in natural convection?

Typical thermal resistance is 14.00°C/W in natural convection.

What is the thermal resistance with forced air flow?

Typical thermal resistance is 4.00°C/W at 600 LFM forced air flow.

What is the attachment method?

The heat sink uses SMD pad attachment for surface mount.

What material is the heat sink made of?

The base is copper with a tin plating finish.

Is the heat sink RoHS compliant?

It is listed as RoHS3 compliant, but this is unverified.

What are the dimensions of the heat sink?

Width 30.99mm, length 12.70mm, fin height 10.20mm.

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