573300D00010G Surface mount board-level heat sink for TO-263 (D2Pak), QFN, and DFN packages. Features tin-plated copper construction, 26.16 x 12.70 mm footprint, 10.16 mm height, and 18°C/W natural convection thermal resistance.
Mfr Part #:

573300D00010G

Available from 4 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Surface mount board-level heat sink for TO-263 (D2Pak), QFN, and DFN packages. Features tin-plated copper construction, 26.16 x 12.70 mm footprint, 10.16 mm height, and 18°C/W natural convection thermal resistance.
Total Stock: 18,264 pcs
$ Price Range: $1.02 - $1.58

573300D00010G Available from 4 distributors

Authorised
Non-Authorised

573300D00010G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Lead Style
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Tape & Reel
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width

573300D00010G Description

Short technical summary and product information.

The 573300D00010G is a surface mount board-level heat sink from Aavid, Thermal Division of Boyd Corporation, part of the Surface Mount 5733 series. It is designed to cool D2 Pak (TO-263), QFN, and DFN semiconductor packages. The heat sink is made of tin-plated copper, enabling direct soldering to printed circuit boards for effective board-level cooling.

 

Key dimensions include a width of 26.16 mm (1.030"), length of 12.70 mm (0.500"), and fin height of 10.16 mm (0.400"). It has a horizontal mounting direction and is attached via an SMD pad. Thermal resistance is 18.00 °C/W under natural convection, and 10.00 °C/W at 200 LFM forced air flow. Under a 30°C temperature rise, the heat sink dissipates 1.3 W.

 

The part is supplied in tape-and-reel packaging (573300D00010G), suitable for high-volume manufacturing; a bulk option (573300D00000G) is also available. The tin-plated surface ensures solderability and the rectangular finned shape provides effective heat dissipation in constrained board spaces. Typical applications include power management circuits, voltage regulators, and other devices in D2Pak, QFN, or DFN packages.

573300D00010G Quick Information

Product Type: Board Level Heat Sink
Series: 5733
Canonical Name: Surface Mount Board-Level Heat Sink for TO-263 (D2Pak), QFN, and DFN Packages
Subcategory: Surface Mount Heat Sink

573300D00010G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

573300D00010G Estimated Pricing

Qty Low High
1+ $1.58 $1.58
10+ $1.43 $1.43
25+ $1.40 $1.40
50+ $1.36 $1.36
100+ $1.28 $1.28
250+ $1.21 $1.21
500+ $1.14 $1.14
1,000+ $1.08 $1.08
5,000+ $1.02 $1.02

Estimated market price range - modelled values for guidance only, not live distributor offers.

573300D00010G Features

  • Tin-plated copper for direct soldering.
  • 18°C/W natural convection thermal resistance.
  • Surface mount for TO-263 D2Pak packages.
  • Tape-and-reel packaging for high-volume assembly.

573300D00010G Applications

  • Cool D2Pak TO-263 power devices.
  • For QFN and DFN package cooling.
  • Used in voltage regulator circuits.
  • Ideal for surface mount PCBs.

573300D00010G FAQs

5 frequently asked questions generated from this part’s specifications.
What package types does this heat sink support?

It supports TO-263 (D2Pak), QFN, and DFN packages, including larger QFNs/DFNs.

What is the thermal resistance under natural convection?

18.00 °C/W typical.

What is the heat sink material and finish?

The datasheet specifies copper material with a tin finish.

What mounting direction and attachment method does the heat sink use?

Horizontal mounting with SMD pad attachment.

Is the 573300D00010G RoHS compliant?

The database lists it as RoHS3 compliant, but this has not been verified from authoritative sources.

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