| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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18,029 pcs
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18029 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
201 pcs
|
201 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
30 pcs
|
30 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
4 pcs
|
4 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 573300D00010G is a surface mount board-level heat sink from Aavid, Thermal Division of Boyd Corporation, part of the Surface Mount 5733 series. It is designed to cool D2 Pak (TO-263), QFN, and DFN semiconductor packages. The heat sink is made of tin-plated copper, enabling direct soldering to printed circuit boards for effective board-level cooling.
Key dimensions include a width of 26.16 mm (1.030"), length of 12.70 mm (0.500"), and fin height of 10.16 mm (0.400"). It has a horizontal mounting direction and is attached via an SMD pad. Thermal resistance is 18.00 °C/W under natural convection, and 10.00 °C/W at 200 LFM forced air flow. Under a 30°C temperature rise, the heat sink dissipates 1.3 W.
The part is supplied in tape-and-reel packaging (573300D00010G), suitable for high-volume manufacturing; a bulk option (573300D00000G) is also available. The tin-plated surface ensures solderability and the rectangular finned shape provides effective heat dissipation in constrained board spaces. Typical applications include power management circuits, voltage regulators, and other devices in D2Pak, QFN, or DFN packages.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.58 | $1.58 |
| 10+ | $1.43 | $1.43 |
| 25+ | $1.40 | $1.40 |
| 50+ | $1.36 | $1.36 |
| 100+ | $1.28 | $1.28 |
| 250+ | $1.21 | $1.21 |
| 500+ | $1.14 | $1.14 |
| 1,000+ | $1.08 | $1.08 |
| 5,000+ | $1.02 | $1.02 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It supports TO-263 (D2Pak), QFN, and DFN packages, including larger QFNs/DFNs.
18.00 °C/W typical.
The datasheet specifies copper material with a tin finish.
Horizontal mounting with SMD pad attachment.
The database lists it as RoHS3 compliant, but this has not been verified from authoritative sources.