573300D00000G Surface mount board level heat sink designed to cool TO-263 (D2Pak) packages. Features copper construction with tin plated finish and 18.00°C/W thermal resistance in natural convection.
Mfr Part #:

573300D00000G

Available from 1 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Surface mount board level heat sink designed to cool TO-263 (D2Pak) packages. Features copper construction with tin plated finish and 18.00°C/W thermal resistance in natural convection.
Total Stock: 131 pcs
$ Price Range: $0.69 - $1.00

573300D00000G Available from 1 distributor

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131 pcs
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573300D00000G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Lead Style
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Tape & Reel
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width

573300D00000G Description

Short technical summary and product information.

The 573300D00000G is a surface mount board level heat sink from Aavid, Thermal Division of Boyd Corporation. It is designed to cool D2Pak (TO-263), QFN, and DFN packages. The heat sink is constructed from copper with a tin plated finish, enabling direct soldering to PCBs for effective thermal management.

 

Key specifications include a width of 26.16mm, length of 12.70mm, and height of 10.16mm. Thermal performance is rated at 18.00°C/W in natural convection and 8.00°C/W at 300 LFM forced air flow. Power dissipation is 1.3W at a 30°C temperature rise.

 

The heat sink uses an SMD pad attachment method for surface mounting. It is RoHS3 compliant and has an MSL of 1 (unlimited). This part is suitable for high-volume manufacturing with tape and reel packaging available as the 573300D00010G variant.

573300D00000G Quick Information

Product Type: Heat Sink
Series: 5733
Canonical Name: Surface Mount Board Level Heat Sink for TO-263 (D2Pak), Copper, Tin Plated, 26.16mm x 12.70mm x 10.16mm
Subcategory: Board Level Heat Sink

573300D00000G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

573300D00000G Estimated Pricing

Qty Low High
1+ $1.00 $1.00
10+ $0.89 $0.89
25+ $0.88 $0.88
50+ $0.86 $0.86
100+ $0.82 $0.82
250+ $0.79 $0.79
500+ $0.76 $0.76
1,000+ $0.73 $0.73
4,000+ $0.69 $0.69

Estimated market price range - modelled values for guidance only, not live distributor offers.

573300D00000G Features

  • Copper construction with tin plated finish.
  • Surface mount SMD pad attachment.
  • 18.00°C/W thermal resistance in natural convection.
  • Designed for TO-263 (D2Pak) packages.
  • 26.16mm width, 12.70mm length, 10.16mm height.

573300D00000G Applications

  • Cooling D2Pak (TO-263) power devices.
  • Suitable for QFN and DFN packages.
  • Used in board level thermal management.
  • Ideal for surface mount PCB designs.

573300D00000G FAQs

7 frequently asked questions generated from this part’s specifications.
What is the RoHS status of the 573300D00000G?

RoHS3 Compliant.

What is the thermal resistance of this heat sink?

18.00°C/W in natural convection and 8.00°C/W at 300 LFM forced air flow.

What is the material and finish?

Copper with tin plated finish.

What are the dimensions?

Width 26.16mm, length 12.70mm, height 10.16mm.

What packages can this heat sink cool?

TO-263 (D2Pak), QFN, and DFN packages.

What is the attachment method?

SMD pad for surface mounting.

What is the power dissipation at 30°C temperature rise?

1.3W.

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