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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
131 pcs
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131 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 573300D00000G is a surface mount board level heat sink from Aavid, Thermal Division of Boyd Corporation. It is designed to cool D2Pak (TO-263), QFN, and DFN packages. The heat sink is constructed from copper with a tin plated finish, enabling direct soldering to PCBs for effective thermal management.
Key specifications include a width of 26.16mm, length of 12.70mm, and height of 10.16mm. Thermal performance is rated at 18.00°C/W in natural convection and 8.00°C/W at 300 LFM forced air flow. Power dissipation is 1.3W at a 30°C temperature rise.
The heat sink uses an SMD pad attachment method for surface mounting. It is RoHS3 compliant and has an MSL of 1 (unlimited). This part is suitable for high-volume manufacturing with tape and reel packaging available as the 573300D00010G variant.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.00 | $1.00 |
| 10+ | $0.89 | $0.89 |
| 25+ | $0.88 | $0.88 |
| 50+ | $0.86 | $0.86 |
| 100+ | $0.82 | $0.82 |
| 250+ | $0.79 | $0.79 |
| 500+ | $0.76 | $0.76 |
| 1,000+ | $0.73 | $0.73 |
| 4,000+ | $0.69 | $0.69 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
RoHS3 Compliant.
18.00°C/W in natural convection and 8.00°C/W at 300 LFM forced air flow.
Copper with tin plated finish.
Width 26.16mm, length 12.70mm, height 10.16mm.
TO-263 (D2Pak), QFN, and DFN packages.
SMD pad for surface mounting.
1.3W.