| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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15,250 pcs
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15250 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 573100D00010G is a surface mount board level heat sink from Aavid, Thermal Division of Boyd Corporation, designed for cooling TO-252 (DPak) packages. It is constructed from copper with a tin plated finish, enabling direct soldering to the PCB for effective thermal management.
The heat sink has a rectangular shape with fins and measures 10.16mm in length, 8.00mm in width, and 22.86mm in height. It is mounted using an SMD pad and is available in tape and reel packaging for high volume manufacturing. Typical thermal performance includes 26.00°C/W in natural convection and 12.50°C/W at 600 LFM forced air. The heat sink can dissipate up to 0.8W at a 30°C temperature rise.
This device is intended for use in applications requiring efficient board level cooling for power semiconductors in the TO-252 package. Its compact size and surface mount compatibility make it suitable for space-constrained designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.20 | $1.20 |
| 1,500+ | $1.20 | $1.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-252 (DPak) packages.
26.00°C/W typical.
Copper with tin plated finish.
Yes, RoHS3 compliant (unverified).
10.16mm length, 8.00mm width, 22.86mm height.
Surface mount SMD pad.
0.8W typical at 30°C temperature rise.