| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,500 pcs
|
2500 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
100 pcs
|
100 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Lead Style | |
| Length | |
| Material | |
| Material Finish | |
| Mounting Type | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| SVHC Present | |
| Shape | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
The 573100D00000G is a board level heat sink from Aavid, Thermal Division of Boyd Corporation, designed for surface mount cooling of TO-252 (DPak) packages. It is part of the Surface Mount 5731 series and is offered in bulk packaging.
Constructed from copper with a tin-plated finish, this heat sink provides effective thermal management. It measures 8 mm in width, 10.16 mm in length, and 22.86 mm in height. The top mount design with SMD pad attachment allows direct soldering to the PCB.
Thermal performance includes a natural convection thermal resistance of 15.00°C/W and 12.50°C/W at 600 LFM forced air flow. It can dissipate 0.8 W at a 30°C temperature rise, making it suitable for moderate power applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.71 | $2.71 |
| 10+ | $2.69 | $2.69 |
| 25+ | $2.50 | $2.50 |
| 50+ | $2.43 | $2.43 |
| 100+ | $2.13 | $2.13 |
| 250+ | $2.04 | $2.04 |
| 500+ | $1.99 | $1.99 |
| 1,000+ | $1.97 | $1.97 |
| 4,000+ | $0.67 | $0.67 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-252 (DPak) packages.
15.00°C/W in natural convection and 12.50°C/W at 600 LFM forced air flow.
Copper with tin plating.
RoHS3 compliant (unverified).
0.8W at 30°C temperature rise.
Surface mount with SMD pad attachment.
22.86 mm.