| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1,000 pcs
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1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 566010B03400G is a board-level vertical heat sink designed to cool Multiwatt and SIP semiconductor packages. It is constructed from black anodized aluminum with a rectangular fin shape, providing effective heat dissipation in both natural convection and forced air environments.
Under natural convection, this heat sink offers a typical thermal resistance of 11.50°C/W, and at 300 LFM forced airflow, the thermal resistance drops to 4.00°C/W. It is rated for a typical power dissipation of 2.0 W at a 30°C temperature rise, making it suitable for moderate-power applications.
Mechanically, the heat sink has a fin height of 12.70 mm (0.500 in), a width of 25.40 mm (1.000 in), and a length of 30.99 mm (1.220 in). It attaches to the PCB using a combination of clip and PC pin mounting, ensuring secure through-hole installation. The package it accommodates is Multiwatt or SIP with a vertical orientation.
All specifications are typical values and should be verified in the target application. The heat sink is RoHS3 compliant and has an MSL rating of Level 1 (unlimited).
| Qty | Low | High |
|---|---|---|
| 1+ | $1.80 | $1.80 |
| 10+ | $1.76 | $1.76 |
| 100+ | $1.69 | $1.69 |
| 250+ | $1.59 | $1.59 |
| 500+ | $1.49 | $1.49 |
| 800+ | $1.41 | $1.41 |
| 2,400+ | $1.32 | $1.32 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
This heat sink is designed to cool Multiwatt and SIP packages.
Yes, it is listed as RoHS3 Compliant.
The typical thermal resistance is 11.50°C/W under natural convection.
The typical thermal resistance is 4.00°C/W at 300 LFM forced airflow.
Fin height: 12.70 mm, width: 25.40 mm, length: 30.99 mm.
It uses clip and PC pin attachment for through-hole mounting.
Typical power dissipation is 2.0 W at a 30°C temperature rise.